SOLUTION
Electronic Components
The main steps in PVD coating technology include cleaning the substrate, pre-treatment to improve coating adhesion, and the actual PVD coating process, which involves heating a source material such as a metal or ceramic to high temperatures until it evaporates, and then depositing it onto the substrate to form a thin, homogeneous layer.The PVD process is able to deposit a wide range of different materials, including metals, alloys, and ceramics, on a variety of substrates, making its application range PVD process can deposit many different materials on different substrates, including metals, alloys, ceramics, etc., which makes its application range more extensive.
Therefore, for the chips in PCB circuit boards, the application of PVD coating technology can effectively improve the chip's abrasion resistance, corrosion resistance and other properties, thus enhancing the overall performance and reliability of the PCB.
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Prescription Coating Materials Coating Technologies Microhardness HIT (GPa) Coefficient of friction (dry) vs. steel Maximum working temperature [°C] Process Temperature
AR ALTINOS Common AlCrN Arc 3500 0.3 1000 < 500
AR LATUMA Common DLC Arc 2000 0.1-0.2 300 < 150
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